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National Semiconductor Corporation
Industria: Semiconductors
Number of terms: 2987
Number of blossaries: 0
Company Profile:
National Semiconductor Corporation designs, develops, manufactures, and markets analog and mixed-signal integrated circuits and sub-systems.
Sample testing which is sufficiently severe to make further use of the tested devices questionable. Devices subjected to destructive testing may not actually be destroyed, but are sufficiently degraded that they should not be used in any system.
Industry:Semiconductors
Plural of die (see die).
Industry:Semiconductors
die
A single square or rectangular piece of silicon into which a specific semiconductor circuit has been diffused.
Industry:Semiconductors
The damage occurring within an oxide layer when a voltage greater than its breakdown strength is applied across it.
Industry:Semiconductors
A semiconductor fabrication process in which each circuit element is enclosed within an oxide barrier that completely isolates the element from all other diffused elements.
Industry:Semiconductors
Dice mounted on flexible ribbon tape by bonding the bonding pads of each die to contacts on a lead frame on the tape, thus allowing electrical and other testing prior to assembly of the die into packages or onto hybrid substrates.
Industry:Semiconductors
アプリケーション特定の集積回路。カスタムまたは半カスタム集積回路、特定のアプリケーション用に作成されたセルまたはゲート アレイなど。アシックスの複雑さは通常、CAD 技術の重要な使用が必要です。
Industry:Semiconductors
デバイスの放射線耐性特性を向上させるためにウェハ製造工程の変更。
Industry:Semiconductors
最大不良率上映すべてのロットの平均として受け入れられると考えられます。与えられた AQL で使われるサンプル サイズ不良率がより高い全ロットの 95% の受け入れを防止します。
Industry:Semiconductors
再ボンディングは前の結合の上に直接配置されます。
Industry:Semiconductors